Bostik SL C955 ADVANCED stands out as a two-part, high-performance smoothing compound that eliminates the need for extensive subfloor preparation, leading to significant time and cost savings.
Thanks to its outstanding flow characteristics, this compound can be directly applied to most common substrates without the necessity of priming. Its remarkable adhesion and minimal shrinkage properties make it suitable for various surfaces, including old adhesive residues, ceramic tiles, Bostik damp-proof membranes, flooring-grade plywood, and resin flooring.
This smoothing compound is resistant to moisture, allowing its application over damp subfloors before the installation of a damp-proof membrane. When mixed with a compatible aggregate, it can be applied in thicknesses ranging from 2mm to 30mm in a single application.
With a quick two-hour walk-on time, this compound facilitates swift project progression. Floor coverings can be laid in as little as four hours under favorable ambient drying conditions. Specifically formulated for compatibility with waterborne underfloor heating systems, it can also be used to encapsulate electric cable-type heating.
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